| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Voltage Rating (DC) | 12.0 V |
| Capacitance | 250 pF |
| Case/Package | 6-WFBGA, FCBGA |
| Halogen Free Status | Halogen Free |
| Shielding | No |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Cut Tape (CT) |
This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an intergrated solution in a small package reducing PCB space and cost.
●Features
●---
● |
● Provides EMI Filtering and ESD Protection
● Single IC Offers Cost Saving by Replacing 2 Inductors, 4 Capacitors, and 4 TVs diodes
● Compliance with IEC61000-4-2, (Level 4) 8kV (Contact), 15kV (air)
● Flip-Chip Package
● Moisture Sensitivity Level 1
● ESD Ratings: Machine Model = C, Human Body Model = 3B
● Pb-Free Solder Bumps
ON Semiconductor
3 Pages / 0.14 MByte
ON Semiconductor
4 Pages / 0.04 MByte
ON Semiconductor
FILTER LC(PI) 2.9nH/250pF SMD
ON Semiconductor
LC (Pi) EMI Filter 3rd Order Low Pass 2Channel L = 2.9nH, C = 250pF 6-WFBGA, FCBGA
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