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W25Q64JVSFIQ
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W25Q64JVSFIQ Datasheet PDF - Winbond Electronics

Manufacturer:Winbond Electronics
Category:Memory Chip
Case Package:16-SOIC (0.295", 7.50mm Width)
Description:Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 6ns 16Pin SOIC
Documentation:W25Q64JVSFIQ Datasheet (77 Pages)
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W25Q64JVSFIQ Specifications

TYPEDESCRIPTION
Case/Package16-SOIC (0.295", 7.50mm Width)
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