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MLG1608B3N9S
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MLG1608B3N9S Datasheet PDF - TDK

Manufacturer:TDK
Category:Single Inductors
Case Package:0603, 1608
Description:Inductor High Frequency Chip Unshielded Multi-Layer 3.9nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 140mOhm DCR 0603 T/R
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MLG1608B3N9S Datasheet PDF
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MLG1608B3N9S Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Number of Pins2 Pin
Case/Package (SI)1608
Case/Package0603, 1608
Inductance3.90 nH
Self Resonant Frequency7.90 GHz
Q-Factor10.0
Resistance60.0 mΩ
Resonant Frequency7.90 GHz
ShieldingNo

MLG1608B3N9S Size & Package

TYPEDESCRIPTION
PackagingCut Tape (CT), Tape & Reel (TR)
Size-Length1.60 mm
Size-Width800 µm
Size-Height800 µm

MLG1608B3N9S Documents

MLG1608B3N9S Other Datasheet PDF
TDK
2 Pages / 0.04 MByte

MLG1608B3N9 Documents

MLG1608B3N9S Datasheet PDF
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Inductor High Frequency Chip Unshielded Multi-Layer 3.9nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 140mOhm DCR 0603 T/R
MLG1608B3N9ST000 Datasheet PDF
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0603 3.9nH 600mA
MLG1608B3N9STD25 Datasheet PDF
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0603 3.9nH 600mA
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