| TYPE | DESCRIPTION |
|---|
| Mounting Style | Through Hole, PC Board |
| Case/Package | TO-218, TO-220, TO-247 |
| Thermal Resistance | 4.40 K/W |
| TYPE | DESCRIPTION |
|---|
| Size-Length | 25.0 mm |
| Size-Width | 42.0 mm |
| Size-Height | 38.1 mm |
The MC33269 is a 38.1 x 25 x 42mm high power dissipation vertical mounting extruded Heat Sink with black anodized finish, solderable fixing pins and a notched base. It can be mounted through mounting holes and is suitable for use with a single TO2-18 TO-220 and TO 247 devices or via clip available separately.
● Choice of thermal resistance
● Low thermal resistance
● Solderable mounting pins
● Pre-drilled mounting holes
Multicomp
2 Pages / 0.45 MByte
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