Description:
●Responding to the market requirement to accommodate ever increasing amounts of silicon in smaller, space saving packages, Infineon introduces the new package TO-247PLUS for 1200V IGBT. Higher current capability, improved thermal behaviour. The TO-247PLUS has the same outer dimensions as the industry standard TO-247, but due to the absence of the screw hole, allows up to 75A in 1200V co-packed with full rated 75A diode.
●Summary of Features:
● High power density – up to 75 A 1200 V IGBT co-packed with 75 A diode in TO-247 footprint
● 20% lower R th(jh) compared to TO-247 3 pin
● Extended collector-emitter pin creepage of 4.25 mm
● Extended clip creepage due to fully encapsulated front side of the package
●Benefits:
● Higher system power density – I c increase keeping the same system thermal performance
● Lower thermal resistance R th(jh) and improved by ~15% heat dissipation capability of TO-247PLUS vs TO-247
● Higher reliability, extended lifetime of the device
