| TYPE | DESCRIPTION |
|---|
| Mounting Style | Screw |
| Case/Package | Module |
| Polarity | NPN |
Summary of Features:
● Low Switching Losses
● Low V(CEsat)
● T(vj op) = 150°C
● V(CEsat) with positive Temperature Coefficient
● Al(2)O(3) Substrate with Low Thermal Resistance
● High Power and Thermal Cycling Capability
● Integrated NTC temperature sensor
● Copper Base Plate
● Solder Contact Technology
● Standard Housing
●Benefits:
● Compact module concept
● Optimized customer’s development cycle time and cost
● Configuration flexibility
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